Flash
MX29GL512GHXFI-10Q
NOR Flash Parallel 3V/3.3V 512M-bit 64M x 8/32M x 16 100ns 64-Pin LFBGA
Macronix International Co., Ltd.Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
3A991.b.1.a
Part Status
Active
HTS
8542.32.00.71
Automotive
No
PPAP
No
Cell Type
NOR
Chip Density (bit)
512M
Architecture
Sectored
Boot Block
Yes
Block Organization
Symmetrical
Location of Boot Block
Bottom|Top
Address Width (bit)
26/25
Sector Size
128Kbyte x 512
Page Size
16Words/32byte
Number of Bits/Word (bit)
8/16
Number of Words
64M/32M
Programmability
Yes
Timing Type
Asynchronous
Max. Access Time (ns)
100
Maximum Erase Time (s)
250/Chip
Maximum Page Access Time (ns)
15
Maximum Programming Time (ms)
0.23/Word
OE Access Time (ns)
25
Interface Type
Parallel
Minimum Operating Supply Voltage (V)
2.7
Typical Operating Supply Voltage (V)
3|3.3
Maximum Operating Supply Voltage (V)
3.6
Programming Voltage (V)
2.7 to 3.6
Operating Current (mA)
55
Page Read Current (mA)
12
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
Command Compatible
Yes
ECC Support
No
Support of Page Mode
Yes
Minimum Endurance (Cycles)
100000
Mounting
Surface Mount
Package Height
0.65(Min)
Package Width
11
Package Length
13
PCB changed
64
Standard Package Name
BGA
Supplier Package
LFBGA
Pin Count
64

