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MX29GL512GDT2I11G|MACRONIX|simage
MX29GL512GDT2I11G|MACRONIX|limage
Flash

MX29GL512GDT2I-11G

NOR Flash Parallel 3V/3.3V 512M-bit 64M x 8/32M x 16 110ns 56-Pin TSOP-I

Macronix International Co., Ltd.
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991.b.1.a
  • Part Status
    Active
  • HTS
    8542.32.00.71
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    NOR
  • Chip Density (bit)
    512M
  • Architecture
    Sectored
  • Boot Block
    Yes
  • Block Organization
    Symmetrical
  • Location of Boot Block
    Bottom|Top
  • Address Width (bit)
    26/25
  • Sector Size
    128Kbyte x 512
  • Page Size
    16Words/32byte
  • Number of Bits/Word (bit)
    8/16
  • Number of Words
    64M/32M
  • Programmability
    Yes
  • Timing Type
    Asynchronous
  • Max. Access Time (ns)
    110
  • Maximum Erase Time (s)
    250/Chip
  • Maximum Page Access Time (ns)
    25
  • Maximum Programming Time (ms)
    0.23/Word
  • OE Access Time (ns)
    30
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    2.7
  • Typical Operating Supply Voltage (V)
    3|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Programming Voltage (V)
    2.7 to 3.6
  • Operating Current (mA)
    55
  • Page Read Current (mA)
    12
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    Yes
  • Minimum Endurance (Cycles)
    100000
  • Mounting
    Surface Mount
  • Package Height
    1
  • Package Width
    18.4
  • Package Length
    14
  • PCB changed
    56
  • Standard Package Name
    SO
  • Supplier Package
    TSOP-I
  • Pin Count
    56
  • Lead Shape
    Gull-wing

Documentation and Resources

Datasheets
Design resources