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MX25R8035FBHIH2TR|MACRONIX|simage
MX25R8035FBHIH2TR|MACRONIX|limage
Flash

MX25R8035FBHIH2 TR

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V/3.3V 8M-bit 8M/4M/2M x 1/2-bit/4-bit 12ns 8-Pin WLCSP

Macronix International Co., Ltd.
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.32.00.71
  • Automotive
    No
  • PPAP
    No
  • Cell Type
    NOR
  • Chip Density (bit)
    8M
  • Architecture
    Sectored
  • Boot Block
    No
  • Block Organization
    Symmetrical
  • Address Width (bit)
    24
  • Sector Size
    4Kbyte x 256
  • Page Size
    256byte
  • Number of Bits/Word (bit)
    1/2/4
  • Number of Words
    8M/4M/2M
  • Timing Type
    Synchronous
  • Max. Access Time (ns)
    12
  • Maximum Erase Time (s)
    30/Chip
  • Maximum Programming Time (ms)
    10/Page
  • Process Technology
    75nm
  • Interface Type
    Serial (SPI, Dual SPI, Quad SPI)
  • Minimum Operating Supply Voltage (V)
    1.65
  • Maximum Operating Frequency (MHz)
    108
  • Typical Operating Supply Voltage (V)
    1.8|3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Programming Voltage (V)
    1.65 to 3.6
  • Operating Current (mA)
    9.5
  • Program Current (mA)
    10
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    No
  • Mounting
    Surface Mount
  • Package Height
    0.23
  • PCB changed
    8
  • Supplier Package
    WLCSP
  • Pin Count
    8

Documentation and Resources

Datasheets
Design resources