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DRAM Chip

MT62F2G32D4DS-023 WT:C

DRAM Chip Mobile LPDDR5X SDRAM 64Gbit 2Gx32 1.05V 315-Pin TFBGA

Micron Technology
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.32.00.36
  • DRAM Type
    Mobile LPDDR5X SDRAM
  • Chip Density (bit)
    64G
  • Organization
    2Gx32
  • Number of Bits/Word (bit)
    32
  • Data Bus Width (bit)
    32
  • Maximum Clock Rate (MHz)
    8533
  • Minimum Operating Temperature (°C)
    -25
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Wireless
  • Number of I/O Lines (bit)
    32
  • Mounting
    Surface Mount
  • PCB changed
    315
  • Standard Package Name
    BGA
  • Supplier Package
    TFBGA
  • Pin Count
    315

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Documentation and Resources

Datasheets
Design resources