DRAM Chip

MT53E256M32D2DS-053 AUT:B

DRAM Chip Mobile LPDDR4 SDRAM 8Gbit 256Mx32 1.1V Automotive AEC-Q100 200-Pin WFBGA

Micron Technology

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.36

• Automotive

  Yes

• PPAP

  Unknown

• DRAM Type

  Mobile LPDDR4 SDRAM

• Chip Density (bit)

  8G

• Organization

  256Mx32

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  1866

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  125

• Number of I/O Lines (bit)

  32

• Mounting

  Surface Mount

• PCB changed

  200

• Standard Package Name

  BGA

• Supplier Package

  WFBGA

• Pin Count

  200

• Lead Shape

  Ball