DRAM Chip

MT53E256M32D2DS-046 AUT:B

DRAM Chip Mobile LPDDR4 SDRAM 8Gbit 256Mx32 Automotive AEC-Q100 200-Pin WFBGA Tray

Micron Technology

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.32

• Automotive

  Yes

• PPAP

  Unknown

• DRAM Type

  Mobile LPDDR4 SDRAM

• Chip Density (bit)

  8G

• Organization

  256Mx32

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  4166

• Number of I/O Lines (bit)

  32

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.8

• Package Width

  10

• Package Length

  14.5

• PCB changed

  200

• Standard Package Name

  BGA

• Supplier Package

  WFBGA

• Pin Count

  200

• Lead Shape

  Ball