DRAM Chip

MT53E1G32D2FW-046 WT:C

32Gb LPDDR DRAM

Micron Technology

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.36

• DRAM Type

  LPDDR4 SDRAM

• Chip Density (bit)

  32G

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  4266

• Minimum Operating Temperature (°C)

  -25

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Wireless

• Number of I/O Lines (bit)

  32

• Mounting

  Surface Mount

• PCB changed

  200

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  200