DRAM Chip

MT53E128M32D2DS-046 WT:A

Mobile LPDDR4 DRAM Chip

Micron Technology

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Obsolete

• HTS

  8542.32.00.28

• Automotive

  No

• PPAP

  No

• DRAM Type

  LPDDR4 SDRAM

• Chip Density (bit)

  4G

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  4266

• Minimum Operating Temperature (°C)

  -25

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Wireless

• Number of I/O Lines (bit)

  32

• Mounting

  Surface Mount

• Package Height

  0.8

• Package Width

  10

• Package Length

  14.5

• PCB changed

  200

• Standard Package Name

  BGA

• Supplier Package

  WFBGA

• Pin Count

  200

• Lead Shape

  Ball