MT52L256M32D1PF-107 WT:B

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  LTB

• HTS

  8542.39.00.90

• Automotive

  No

• PPAP

  No

• DRAM Type

  Mobile LPDDR3 SDRAM

• Chip Density (bit)

  8G

• Organization

  256Mx32

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  1866

• Minimum Operating Temperature (°C)

  -30

• Maximum Operating Temperature (°C)

  85

• Number of I/O Lines (bit)

  32

• Packaging

  Tray

• Mounting

  Surface Mount

• PCB changed

  178

• Standard Package Name

  BGA

• Supplier Package

  WFBGA

• Pin Count

  178