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DRAM Chip

MT48LC2M32B2B5-6A IT:J TR

DRAM Chip SDR SDRAM 64Mbit 2Mx32 3.3V 90-Pin VFBGA T/R

Micron Technology
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    LTB
  • HTS
    8542.32.00.24
  • DRAM Type
    SDR SDRAM
  • Chip Density (bit)
    64M
  • Organization
    2Mx32
  • Number of Internal Banks
    4
  • Number of Words per Bank
    512K
  • Number of Bits/Word (bit)
    32
  • Data Bus Width (bit)
    32
  • Maximum Clock Rate (MHz)
    167
  • Maximum Access Time (ns)
    17|7.5|5.4
  • Address Bus Width (bit)
    13
  • Process Technology
    50nm
  • Interface Type
    LVTTL
  • Minimum Operating Supply Voltage (V)
    3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    120
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Number of I/O Lines (bit)
    32
  • Packaging
    Tape and Reel
  • Mounting
    Surface Mount
  • Package Height
    0.65
  • Package Width
    8
  • Package Length
    13
  • PCB changed
    90
  • Standard Package Name
    BGA
  • Supplier Package
    VFBGA
  • Pin Count
    90
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources