DRAM Chip
MT48LC2M32B2B5-6A IT:J TR
DRAM Chip SDR SDRAM 64Mbit 2Mx32 3.3V 90-Pin VFBGA T/R
Micron TechnologyProduct Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
LTB
HTS
8542.32.00.24
DRAM Type
SDR SDRAM
Chip Density (bit)
64M
Organization
2Mx32
Number of Internal Banks
4
Number of Words per Bank
512K
Number of Bits/Word (bit)
32
Data Bus Width (bit)
32
Maximum Clock Rate (MHz)
167
Maximum Access Time (ns)
17|7.5|5.4
Address Bus Width (bit)
13
Process Technology
50nm
Interface Type
LVTTL
Minimum Operating Supply Voltage (V)
3
Maximum Operating Supply Voltage (V)
3.6
Operating Current (mA)
120
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
Number of I/O Lines (bit)
32
Packaging
Tape and Reel
Mounting
Surface Mount
Package Height
0.65
Package Width
8
Package Length
13
PCB changed
90
Standard Package Name
BGA
Supplier Package
VFBGA
Pin Count
90
Lead Shape
Ball