DRAM Chip

MT48LC16M16A2P-6A IT:G

DRAM Chip SDR SDRAM 256Mbit 16Mx16 3.3V 54-Pin TSOP-II Tray

Micron Technology

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Obsolete

• HTS

  8542.32.00.24

• Automotive

  No

• PPAP

  No

• DRAM Type

  SDR SDRAM

• Chip Density (bit)

  256M

• Organization

  16Mx16

• Number of Internal Banks

  4

• Number of Words per Bank

  4M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  167

• Maximum Access Time (ns)

  17|7.5|5.4

• Address Bus Width (bit)

  15

• Process Technology

  50nm

• Interface Type

  LVTTL

• Minimum Operating Supply Voltage (V)

  3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  100

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  16

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1(Max)

• Package Width

  10.16

• Package Length

  22.22

• PCB changed

  54

• Standard Package Name

  SO

• Supplier Package

  TSOP-II

• Pin Count

  54

• Lead Shape

  Gull-wing