DRAM Chip

MT47H128M16RT-25E IT:C

DRAM Chip DDR2 SDRAM 2Gbit 128Mx16 1.8V 84-Pin FBGA Tray

Micron Technology

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  LTB

• HTS

  8542.32.00.24

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR2 SDRAM

• Chip Density (bit)

  2G

• Organization

  128Mx16

• Number of Internal Banks

  8

• Number of Words per Bank

  16M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  800

• Maximum Access Time (ns)

  0.4

• Address Bus Width (bit)

  17

• Process Technology

  50nm

• Interface Type

  SSTL_18

• Minimum Operating Supply Voltage (V)

  1.7

• Maximum Operating Supply Voltage (V)

  1.9

• Operating Current (mA)

  190

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  16

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.96

• Package Width

  9

• Package Length

  12.5

• PCB changed

  84

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  84

• Lead Shape

  Ball