Flash

MT29F2G08ABAEAWP-IT:E

NAND Flash Parallel 3.3V 2G-bit 256M x 8 48-Pin TSOP-I Tray

Micron Technology

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  LTB

• HTS

  8542.32.00.51

• Automotive

  No

• PPAP

  No

• Cell Type

  NAND

• Chip Density (bit)

  2G

• Architecture

  Sectored

• Boot Block

  Yes

• Block Organization

  Symmetrical

• Address Width (bit)

  29

• Sector Size

  128Kbyte x 2048

• Page Size

  2Kbyte

• Number of Bits/Word (bit)

  8

• Number of Words

  256M

• Programmability

  Yes

• Timing Type

  Asynchronous

• Maximum Erase Time (s)

  0.003/Block

• Maximum Programming Time (ms)

  0.6/Page

• Process Technology

  34nm

• Interface Type

  Parallel

• Minimum Operating Supply Voltage (V)

  2.7

• Typical Operating Supply Voltage (V)

  3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  35

• Program Current (mA)

  35

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Command Compatible

  No

• ECC Support

  Yes

• Support of Page Mode

  Yes

• Minimum Endurance (Cycles)

  100000

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1(Max)

• Package Width

  18.4

• Package Length

  12

• PCB changed

  48

• Standard Package Name

  SO

• Supplier Package

  TSOP-I

• Pin Count

  48

• Lead Shape

  Gull-wing