Flash

MT25QU01GBBB8E12-0AUT

NOR Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 1G-bit 256M x 4-bit 6ns 24-Pin TBGA Tray Automotive AEC-Q100

Micron Technology

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  3A991b.1.a.

• Part Status

  Active

• HTS

  COMPONENTS

• Automotive

  Yes

• PPAP

  Unknown

• Cell Type

  NOR

• Chip Density (bit)

  1G

• Architecture

  Sectored

• Boot Block

  No

• Block Organization

  Symmetrical

• Address Width (bit)

  32

• Sector Size

  64Kbyte x 2048

• Page Size

  256byte

• Number of Bits/Word (bit)

  4

• Number of Words

  256M

• Programmability

  Yes

• Timing Type

  Synchronous

• Max. Access Time (ns)

  6

• Maximum Erase Time (s)

  1/Sector

• Maximum Programming Time (ms)

  1.8/Page

• Interface Type

  Serial (SPI, Dual SPI, Quad SPI)

• Minimum Operating Supply Voltage (V)

  1.7

• Maximum Operating Frequency (MHz)

  166

• Typical Operating Supply Voltage (V)

  1.8

• Maximum Operating Supply Voltage (V)

  2

• Operating Current (mA)

  55

• Program Current (mA)

  35

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  125

• Supplier Temperature Grade

  Automotive

• Command Compatible

  Yes

• ECC Support

  No

• Support of Page Mode

  No

• Minimum Endurance (Cycles)

  100000

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.8

• Package Width

  6

• Package Length

  8

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  TBGA

• Pin Count

  24

• Lead Shape

  Ball