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Dev Kit

MR2A16AMA35

MRAM 4Mbit Parallel Interface 3.3V 48-Pin FBGA Tray

Everspin Technologies

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.71

• SVHC

  Yes

• SVHC Exceeds Threshold

  Yes

• Automotive

  No

• PPAP

  No

• Chip Density (bit)

  4M

• Density Range (bit)

  256K to 8M

• Organization

  256Kx16

• Data Bus Width (bit)

  16

• Max. Access Time (ns)

  35

• Process Technology

  180nm

• Interface Type

  Parallel

• Minimum Operating Supply Voltage (V)

  3

• Typical Operating Supply Voltage (V)

  3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  155

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  70

• Supplier Temperature Grade

  Commercial

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.02 mm

• Package Width

  8 mm

• Package Length

  8 mm

• PCB changed

  48

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  48

• Lead Shape

  Ball