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MR2A16ACMA35|EVERSPIN|simage
MR2A16ACMA35|EVERSPIN|limage
Dev Kit

MR2A16ACMA35

MRAM 4Mbit Parallel Interface 3.3V 48-Pin FBGA Tray

Everspin Technologies
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.32.00.41
  • SVHC
    Yes
  • SVHC Exceeds Threshold
    Yes
  • Automotive
    No
  • PPAP
    No
  • Chip Density (bit)
    4M
  • Density Range (bit)
    256K to 8M
  • Organization
    256Kx16
  • Data Bus Width (bit)
    16
  • Max. Access Time (ns)
    35
  • Process Technology
    180nm
  • Interface Type
    Parallel
  • Minimum Operating Supply Voltage (V)
    3
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    165
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    1.02
  • Package Width
    8
  • Package Length
    8
  • PCB changed
    48
  • Standard Package Name
    BGA
  • Supplier Package
    FBGA
  • Pin Count
    48
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources