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MR25H256MDF|EVERSPIN|simage
MR25H256MDF|EVERSPIN|limage
Dev Kit

MR25H256MDF

MRAM 256Kbit Serial-SPI Interface 3.3V Automotive AEC-Q100 8-Pin DFN EP Tray

Everspin Technologies
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    NRND
  • HTS
    8542.32.00.71
  • Automotive
    Yes
  • PPAP
    Unknown
  • Chip Density (bit)
    256K
  • Density Range (bit)
    256K to 8M
  • Organization
    32Kx8
  • Data Bus Width (bit)
    8
  • Max. Access Time (ns)
    10
  • Interface Type
    Serial-SPI
  • Minimum Operating Supply Voltage (V)
    3
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    27
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    125
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    0.85(Max) mm
  • Package Width
    6 mm
  • Package Length
    5 mm
  • PCB changed
    8
  • Standard Package Name
    DFN
  • Supplier Package
    DFN EP
  • Pin Count
    8
  • Lead Shape
    No Lead

Documentation and Resources

Datasheets
Design resources