Dev Kit

MR25H10MDF

MRAM 1Mbit Serial-SPI Interface 3.3V 8-Pin DFN EP Tray Automotive AEC-Q100

Everspin Technologies

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  COMPONENTS

• Automotive

  Yes

• PPAP

  Unknown

• Chip Density (bit)

  1M

• Density Range (bit)

  256K to 8M

• Organization

  128Kx8

• Data Bus Width (bit)

  8

• Max. Access Time (ns)

  10

• Interface Type

  Serial-SPI

• Minimum Operating Supply Voltage (V)

  3

• Typical Operating Supply Voltage (V)

  3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  27

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  125

• Supplier Temperature Grade

  Automotive

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  0.85(Max)

• Package Width

  6.1(Max)

• Package Length

  5.1(Max)

• PCB changed

  8

• Standard Package Name

  DFN

• Supplier Package

  DFN EP

• Pin Count

  8

• Lead Shape

  No Lead