Dev Kit

MR10Q010VMB

MRAM 1Mbit Serial-SPI Interface 3.3V 24-Pin BGA Tray

Everspin Technologies

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.71

• SVHC

  Yes

• SVHC Exceeds Threshold

  Yes

• Automotive

  Unknown

• PPAP

  Unknown

• Chip Density (bit)

  1M

• Density Range (bit)

  256K to 8M

• Organization

  128Kx8

• Data Bus Width (bit)

  8

• Max. Access Time (ns)

  7

• Interface Type

  Serial-SPI

• Minimum Operating Supply Voltage (V)

  3

• Typical Operating Supply Voltage (V)

  3.3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  100

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Extended

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.03(Max) mm

• Package Width

  6 mm

• Package Length

  8 mm

• PCB changed

  24

• Standard Package Name

  BGA

• Supplier Package

  BGA

• Pin Count

  24