Application Processors and SOCs

MIMX8MQ6CVAHZAB

SOC i.MX 8M ARM Cortex A53/ARM Cortex M4 621-Pin FBGA Tray

NXP Semiconductors

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  5A992c.

• Part Status

  Active

• HTS

  8542.31.00.70

• Automotive

  No

• PPAP

  No

• Family Name

  i.MX 8M

• Device Core

  ARM Cortex A53|ARM Cortex M4

• Maximum Clock Rate (MHz)

  1300

• Program Memory Type

  ROM

• Data Bus Width (bit)

  32

• Program Memory Size

  128KB

• RAM Size

  160KB

• Type

  Applications Processor

• Processing Unit

  Microcontroller

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Interface Type

  Ethernet/I2C/SPI/UART/USB

• SPI

  3

• I2C

  4

• I2S

  0

• UART

  4

• USB

  2

• Instruction Cache Size

  32KB|16KB

• USART

  0

• CAN

  0

• PCI

  2

• Ethernet

  1

• Programmability

  Yes

• Core Architecture

  ARM

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1.73

• Package Width

  17

• Package Length

  17

• PCB changed

  621

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  621