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MF1SEP1031DA403J|NXP|limage
MF1SEP1031DA403J|NXP|simage
Smart Card Interface

MF1SEP1031DA4/03J

Smart Card Interface 200mW T/R PLLMC

NXP Semiconductors
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    5A992c.
  • Part Status
    Active
  • HTS
    8542.31.00.01
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Standard Supported
    ISO/IEC 14443-3
  • Maximum Supply Current (mA)
    30
  • Maximum Power Dissipation (mW)
    200
  • Minimum Operating Temperature (°C)
    -25
  • Maximum Operating Temperature (°C)
    70
  • Packaging
    Tape and Reel
  • Mounting
    Surface Mount
  • Package Height
    0.33(Max)
  • Package Length
    35.05(Max)
  • Supplier Package
    PLLMC

Documentation and Resources

Datasheets
Design resources