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LSM6DSV16BXTR

Accelerometer and Gyroscope Sensor

STMicroelectronics
Datasheets 

6-axis IMU with embedded sensor fusion, I3C, OIS/EIS for smart applications

he LSM6DSV is a high-end, low-noise, low-power 6-axis IMU, featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, with a triple core for processing acceleration and angular rate data on three separate channels (user interface, OIS, and EIS) with dedicated configuration, processing, and filtering.

The LSM6DSV enables processes in edge computing, leveraging embedded advanced dedicated features such as a sensor fusion low-power (SFLP) algorithm and a finite state machine (FSM) for configurable motion tracking.

The LSM6DSV supports the adaptive self-configuration (ASC) feature, which allows the FSM to automatically reconfigure the device in real time based on the detection of a specific motion pattern, without any intervention from the host processor.



Features and Benefits:

  • Triple core for UI, EIS, and OIS data processing
  • "Always-on" experience with low power consumption for both accelerometer
  • and gyroscope
  • Smart FIFO up to 4.5 KB
  • Android compliant
  • ±2/±4/±8/±16 g full scale
  • ±125/±250/±500/±1000/±2000/±4000 dps full scale
  • SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
  • Auxiliary SPI for OIS data output for gyroscope and accelerometer
  • OIS configurable from aux. SPI, primary interface (SPI / I²C & MIPI I3C® v1.1)
  • EIS dedicated channel on primary interface with dedicated filtering
  • Specific IP blocks (called "embedded functions") with negligible power consumption and high performance
    • Pedometer functions: step detector and step counters
    • Tilt
    • Significant motion detection
    • Finite state machine (FSM) - Programmable for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
    • Adaptive self-configuration (ASC)
    • Embedded sensor fusion low-power (SFLP) algorithm
  • Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click
  • Embedded temperature sensor
  • Analog supply voltage: 1.71 V to 3.6 V
  • Independent IO supply (extended range: 1.08 V to 3.6 V)
  • Power consumption: 0.65 mA in combo high-performance mode
  • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
  • ECOPACK and RoHS compliant




Applications and Use Cases:

  • Motion tracking and gesture detection, augmented reality (AR) / virtual reality (VR) / mixed reality (MR) applications & metaverse applications
  • Wearables
  • Indoor navigation
  • IoT and connected devices
  • Smartphones and handheld devices
  • EIS and OIS for camera applications
  • Vibration monitoring and compensation


Product Technical Specifications
  • EU RoHS
    Compliant with Exemption
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.39.00.90
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Mounting
    Surface Mount
  • Package Height
    0.74(Max)
  • Package Width
    2.5
  • Package Length
    3
  • PCB changed
    14
  • Standard Package Name
    LGA
  • Supplier Package
    LGA
  • Pin Count
    14

Documentation and Resources

Datasheets
Design resources