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LPC5526JBD64K|NXP|simage
LPC5526JBD64K|NXP|limage
Microcontrollers - MCUs

LPC5526JBD64K

MCU 32-bit ARM Cortex M33 RISC 256KB Flash 3.3V 64-Pin HTQFP EP Tray

NXP Semiconductors
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991a.2.
  • Part Status
    Active
  • HTS
    8542.31.00.25
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Instruction Set Architecture
    RISC
  • Device Core
    ARM Cortex M33
  • Core Architecture
    ARM
  • Maximum CPU Frequency (MHz)
    150
  • Maximum Clock Rate (MHz)
    150
  • Data Bus Width (bit)
    32
  • Program Memory Type
    Flash
  • Program Memory Size
    256KB
  • RAM Size
    144KB
  • Programmability
    Yes
  • Process Technology
    40nm
  • Interface Type
    I2C/I2S/SPI/USART/USB
  • Number of I/Os
    36
  • No. of Timers
    5
  • Number of ADCs
    1
  • ADC Channels
    10
  • ADC Resolution (bit)
    16
  • USART
    8
  • UART
    8
  • USB
    2
  • SPI
    8
  • I2C
    8
  • I2S
    8
  • CAN
    0
  • Ethernet
    0
  • Minimum Operating Supply Voltage (V)
    1.8
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    105
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    1.05(Max)
  • Package Width
    10
  • Package Length
    10
  • PCB changed
    64
  • Standard Package Name
    QFP
  • Supplier Package
    HTQFP EP
  • Pin Count
    64

Documentation and Resources

Datasheets
Design resources