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LPC5516JEV98E|NXP|simage
LPC5516JEV98E|NXP|limage
Microcontrollers - MCUs

LPC5516JEV98E

MCU 32-bit ARM Cortex M33 RISC 256KB Flash 3.3V 98-Pin VFBGA Tray

NXP Semiconductors
Datasheets 

Overview 

The LPC551x/S1x MCU family expands the world’s first general purpose Cortex-M33-based MCU series, offering significant advantages for developers, including pin-, software- and peripheral-compatibility for ease of use and to accelerate time to market, while leveraging the cost-effective 40-nm NVM process technology.

The LPC551x/S1x is the baseline family within the LPC5500 MCU series, providing new levels of cost and performance efficiency in addition to advanced security and system integration for industrial and general embedded markets.

FEATURED

Cortex-M33 core

  • • Running at a frequency of up to 150 MHz
  • • TrustZone®, Floating Point Unit (FPU) and Memory Protection Unit (MPU)
  • • Cortex-M33 built-in Nested Vectored Interrupt Controller (NVIC)
  • • Nonmaskable Interrupt (NMI) input with a selection of sources
  • • Serial Wire Debug with eight breakpoints and four watch points. Includes Serial Wire Output for enhanced debug capabilities
  • • System tick timer

On-chip memory

  • • Up to 256 KB on-chip flash program memory with flash accelerator and 256 byte page erase and write
  • • Up to 96 KB total SRAM consisting of 16 KB SRAM on Code Bus, 64 KB SRAM on System Bus (64 KB is contiguous), and additional 16 KB USB SRAM on System Bus which can be used by the USB interface or for general-purpose use

Security features

  • • Arm TrustZone® enabled
  • • PRINCE module for real-time encryption of data being written to on-chip flash and decryption of encrypted flash data during read to allow asset protection
  • • CASPER Crypto co-processor is provided to enable hardware acceleration for various functions required for certain asymmetric cryptographic algorithms, such as Elliptic Curve Cryptography (ECC)
  • • AES-256 encryption/decryption engine
  • • Secure Hash Algorithm (SHA2) module supporting secure boot with dedicated DMA controller
  • • Physical Unclonable Function (PUF) using dedicated SRAM for silicon fingerprint. PUF can generate, store, and reconstruct key sizes from 64 to 4096 bits. Includes hardware for key extraction
  • • 128-bit unique device serial number for identification (UUID)
  • • Secure GPIO
  • • True Random Number Generator (TRNG)
  • • Code Watchdog

Serial interfaces

  • • FlexComm Interface contains up to nine serial peripherals. Each FlexComm Interface can be selected by software to be a USART, SPI, I2C, and I2S interface
  • • I2C-bus interfaces support Fast-mode and Fast-mode Plus with data rates of up to 1Mbit/s and with multiple address recognition and monitor mode
  • • USB 2.0 full speed host/device controller with on-chip PHY and dedicated DMA controller supporting crystal-less operation in device mode
  • • USB 2.0 high-speed host/device controller with on-chip high-speed PHY

Digital peripherals

  • • DMA0 controller with 23 channels and up to 22 programmable triggers, able to access all memories and DMA-capable peripherals
  • • DMA1 controller with 10 channels and up to 15 programmable triggers, able to access all memories and DMA-capable peripherals
  • • CAN FD module with dedicated DMA controller
  • • CRC engine block can calculate a CRC on supplied data using one of three standard polynomials with DMA support
  • • Up to 64 General-Purpose Input/Output (GPIO) pins
  • • GPIO registers are located on the AHB for fast access. The DMA supports GPIO ports
  • • Up to eight GPIOs can be selected as Pin Interrupts (PINT), triggered by rising, falling or both input edges
  • • Two GPIO Grouped Interrupts (GINT) enable an interrupt based on a logical (AND/OR) combination of input states
  • • I/O pin configuration with support for up to 16 function options
  • • Programmable Logic Unit (PLU) to create small combinational and/or sequential logic networks including state machines

Analog peripherals

  • • 16-bit ADC with five differential channel pair (or 10 singled-ended channels), and with multiple internal and external trigger inputs and sample rates of up to 2.0MSamples/sec. The ADC supports two independent conversion sequences
  • • Integrated temperature sensor connected to the ADC
  • • Comparator with five input pins and external or internal reference voltage

Timers

  • • Five 32-bit standard general-purpose asynchronous timers/counters, which support up to four capture inputs and four compare outputs. Specific timer events can be selected to generate DMA requests
  • • One SCTimer/PWM with 8 input and 10 output functions (including 16 capture and match registers). Inputs and outputs can be routed to or from external pins and internally to or from selected peripherals. Internally, the SCTimer/PWM supports 16 match/captures, 16 events, and 32 states
  • • 32-bit Real-time clock (RTC) with 1 s resolution running in the always-on power domain. Anotehr timer in the RTC can be used for wake up from all low power modes including deep power-down, with 1 ms resolution
  • • Multiple-channel multi-rate 24-bit timer (MRT) for repetitive interrupt generation at up to four programmable, fixed rates
  • • Windowed Watchdog Timer (WWDT) with FRO 1 MHZ as a clock source
  • • Micro-Tick Timer running from the watchdog oscillator can be sued to wake up the device from sleep and deep-sleep modes
  • • 42-bit free running OS Timer as continuous time-base for the system, available in any reduced power modes

Clock generation

  • • Internal Free Running Oscillator (FRO)
  • • 32 kHz Internal Free Running Oscillator FRO
  • • Internal low power oscillator (FRO 1 MHz)
  • • Crystal oscillator with an operating frequency of 1 MHz to 25 MHz. Option for external clock input (bypass mode) for clock frequencies of up to 25 MHz
  • • Crystal oscillator with 32.768 kHz operating frequency
  • • PLL0 and LLL1 allows CPU operation up to the maximum CPU rate without the need for a high-frequency external clock
  • • Clock output function with divider to monitor internal clocks
  • • Frequency measurement unit for measuring the frequency of any on-chip or off-chip clock signal

Power-saving modes

  • • Integrated Power Management Unit (PMU) to minimize power consumption
  • • Reduced power modes: Sleep, deep-sleep with RAM retention, power-down with RAM retention and CPU0 retention, and deep power-down with RAM retention
  • • Configurable wake up options from peripheral interrupts
  • • The Micro-Tick Timer running from the watchdog oscillator, and the Real-Time Clock (RTC) running from the 32.678 kHz clock, can be used to wake up the device from sleep and deep-sleep modes
  • • Power-On Reset (POR)
  • • Brown-Out-Detectors (BOD) with separate thresholds for interrupt and forced reset

Additional information

  • • Operating from an internal DC-DC converter
  • • Single power supply 1.8V to 3.6V
  • • JTAG boundary scan supported
  • • Operating temperature range -40 °C to +105 °C
  • • Available in HLQFP100, VFBGA98 and HTQFP64 packages

Download Factsheet

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    3A991a.2.
  • Part Status
    Active
  • HTS
    8542.31.00.25
  • SVHC
    Yes
  • Automotive
    No
  • PPAP
    No
  • Instruction Set Architecture
    RISC
  • Device Core
    ARM Cortex M33
  • Core Architecture
    ARM
  • Maximum CPU Frequency (MHz)
    150
  • Maximum Clock Rate (MHz)
    150
  • Data Bus Width (bit)
    32
  • Program Memory Type
    Flash
  • Program Memory Size
    256KB
  • RAM Size
    96KB
  • Programmability
    Yes
  • Process Technology
    40nm
  • Interface Type
    I2C/I2S/SPI/USART/USB
  • Number of I/Os
    64
  • No. of Timers
    5
  • Number of ADCs
    1
  • ADC Channels
    10
  • ADC Resolution (bit)
    16
  • USART
    8
  • UART
    8
  • USB
    2
  • SPI
    8
  • I2C
    8
  • I2S
    8
  • CAN
    0
  • Ethernet
    0
  • Minimum Operating Supply Voltage (V)
    1.8
  • Typical Operating Supply Voltage (V)
    3.3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    105
  • Packaging
    Tray
  • Mounting
    Surface Mount
  • Package Height
    0.72(Max)
  • Package Width
    7
  • Package Length
    7
  • PCB changed
    98
  • Standard Package Name
    BGA
  • Supplier Package
    VFBGA
  • Pin Count
    98

Documentation and Resources

Datasheets
Design resources