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LE25U40CMDTWG|ONSEMI|simage
LE25U40CMDTWG|ONSEMI|limage
Flash

LE25U40CMDTWG

Flash Serial (SPI, Dual SPI) 2.5V 4M-bit 512K x 8 11ns 8-Pin SOIC N T/R

onsemi
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Obsolete
  • HTS
    8542.32.00.71
  • Automotive
    No
  • PPAP
    No
  • Chip Density (bit)
    4M
  • Architecture
    Sectored
  • Block Organization
    Symmetrical
  • Address Width (bit)
    1
  • Sector Size
    64Kbyte x 8
  • Page Size
    256byte
  • Number of Bits/Word (bit)
    8
  • Number of Words
    512K
  • Programmability
    Yes
  • Timing Type
    Synchronous
  • Max. Access Time (ns)
    11
  • Maximum Erase Time (s)
    2/Chip
  • Maximum Programming Time (ms)
    5/Page
  • Interface Type
    Serial (SPI, Dual SPI)
  • Minimum Operating Supply Voltage (V)
    2.3
  • Typical Operating Supply Voltage (V)
    2.5
  • Maximum Operating Supply Voltage (V)
    3.6
  • Programming Voltage (V)
    2.3 to 3.6
  • Operating Current (mA)
    12
  • Program Current (mA)
    15
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Command Compatible
    Yes
  • ECC Support
    No
  • Support of Page Mode
    No
  • Packaging
    Tape and Reel
  • Mounting
    Surface Mount
  • Package Height
    1.38
  • Package Width
    3.9
  • Package Length
    4.9
  • PCB changed
    8
  • Standard Package Name
    SO
  • Supplier Package
    SOIC N
  • Pin Count
    8
  • Lead Shape
    Gull-wing

Documentation and Resources

Datasheets
Design resources