DRAM Chip

K4FBE3D4HM-GHCL02V

DRAM Chip Mobile LPDDR4 SDRAM 32Gbit 1Gx32 1.1V/1.8V 200-Pin FPGA

Samsung Electronics

Product Technical Specifications

• EU RoHS

  Supplier Unconfirmed

• ECCN (US)

  EAR99

• Part Status

  Obsolete

• HTS

  8542.32.00.36

• Automotive

  No

• PPAP

  No

• DRAM Type

  Mobile LPDDR4 SDRAM

• Chip Density (bit)

  32G

• Organization

  1Gx32

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  4266

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Number of I/O Lines (bit)

  32

• Mounting

  Surface Mount

• PCB changed

  200

• Supplier Package

  FPGA

• Pin Count

  200