DRAM Chip

K4B4G1646D-BHMA

DRAM Chip DDR3 SDRAM 4Gbit 256Mx16 1.35V 96-Pin FBGA

Samsung Electronics

Product Technical Specifications

• EU RoHS

  Supplier Unconfirmed

• ECCN (US)

  4A994a.

• Part Status

  Obsolete

• HTS

  8542.32.00.36

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR3 SDRAM

• Chip Density (bit)

  4G

• Organization

  256Mx16

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  1866

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Number of I/O Lines (bit)

  16

• Mounting

  Surface Mount

• PCB changed

  96

• Standard Package Name

  BGA

• Supplier Package

  FBGA

• Pin Count

  96