DRAM Chip

IS49RL18320-093BL

DRAM Chip DDR RLDRAM3 576Mbit 32Mx18 1.35V/2.5V 168-Pin FCBGA

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  NRND

• HTS

  8542.32.00.32

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR RLDRAM3

• Chip Density (bit)

  576M

• Organization

  32Mx18

• Number of Internal Banks

  16

• Number of Words per Bank

  2M

• Number of Bits/Word (bit)

  18

• Data Bus Width (bit)

  18

• Maximum Clock Rate (MHz)

  1066

• Maximum Access Time (ns)

  10

• Address Bus Width (bit)

  24

• Minimum Operating Supply Voltage (V)

  1.28|2.38

• Maximum Operating Supply Voltage (V)

  1.42|2.63

• Operating Current (mA)

  1740

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  95

• Supplier Temperature Grade

  Commercial

• Number of I/O Lines (bit)

  18

• Mounting

  Surface Mount

• Package Height

  0.75(Max)

• Package Width

  13.5

• Package Length

  13.5

• PCB changed

  168

• Standard Package Name

  BGA

• Supplier Package

  FCBGA

• Pin Count

  168

• Lead Shape

  Ball