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DRAM Chip

IS46TR16512BL-107MBLA1-TR

DRAM Chip DDR3L SDRAM 8Gbit 512Mx16 1.35V 96-Pin TWBGA T/R Automotive AEC-Q100

Integrated Silicon Solution Inc
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.32.00.36
  • Automotive
    Yes
  • PPAP
    Yes
  • DRAM Type
    DDR3L SDRAM
  • Chip Density (bit)
    8G
  • Organization
    512Mx16
  • Number of Internal Banks
    8
  • Number of Words per Bank
    64M
  • Number of Bits/Word (bit)
    16
  • Data Bus Width (bit)
    16
  • Maximum Clock Rate (MHz)
    1866
  • Address Bus Width (bit)
    19
  • Minimum Operating Supply Voltage (V)
    1.283
  • Maximum Operating Supply Voltage (V)
    1.45
  • Operating Current (mA)
    223
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    95
  • Supplier Temperature Grade
    Automotive
  • Number of I/O Lines (bit)
    16
  • Mounting
    Surface Mount
  • Package Height
    1(Max)
  • Package Width
    10
  • Package Length
    14
  • PCB changed
    96
  • Standard Package Name
    BGA
  • Supplier Package
    TWBGA
  • Pin Count
    96

Documentation and Resources

Datasheets
Design resources