DRAM Chip
IS46LQ32128A-062BLA2
DRAM Chip Mobile LPDDR4 SDRAM 4Gbit 128Mx32 1.1V/1.8V 200-Pin VFBGA Automotive AEC-Q100
Integrated Silicon Solution IncProduct Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
8542.32.00.36
Automotive
Yes
PPAP
Yes
DRAM Type
Mobile LPDDR4 SDRAM
Chip Density (bit)
4G
Organization
128Mx32
Number of Internal Banks
8
Number of Words per Bank
16M
Number of Bits/Word (bit)
32
Data Bus Width (bit)
32
Maximum Clock Rate (MHz)
3200
Maximum Access Time (ns)
3.5
Address Bus Width (bit)
17
Interface Type
LVSTL
Minimum Operating Supply Voltage (V)
1.7|1.06
Maximum Operating Supply Voltage (V)
1.95|1.17
Operating Current (mA)
610
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
105
Supplier Temperature Grade
Automotive
Number of I/O Lines (bit)
32
Mounting
Surface Mount
Package Height
0.52(Max)
Package Width
10
Package Length
14.5
PCB changed
200
Standard Package Name
BGA
Supplier Package
VFBGA
Pin Count
200
Lead Shape
Ball