DRAM Chip

IS45S16800F-7BLA2

DRAM Chip SDRAM 128Mbit 8Mx16 3.3V Automotive 54-Pin TFBGA

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Obsolete

• HTS

  8542.32.00.02

• Automotive

  Yes

• PPAP

  Yes

• DRAM Type

  SDRAM

• Chip Density (bit)

  128M

• Organization

  8Mx16

• Number of Internal Banks

  4

• Number of Words per Bank

  2M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  143

• Maximum Access Time (ns)

  5.4

• Address Bus Width (bit)

  14

• Process Technology

  72nm

• Interface Type

  LVTTL

• Minimum Operating Supply Voltage (V)

  3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  100

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Automotive

• Number of I/O Lines (bit)

  16

• Mounting

  Surface Mount

• Package Height

  0.8(Max)

• Package Width

  8

• Package Length

  8

• PCB changed

  54

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  54

• Lead Shape

  Ball