DRAM Chip

IS45S16320F-7BLA2

DRAM Chip SDRAM 512Mbit 32Mx16 3.3V 54-Pin TW-BGA Automotive AEC-Q100

Integrated Silicon Solution Inc

Product Technical Specifications

• 欧盟RoHS指令

  Compliant

• 美国出口管制分类ECCN编码

  EAR99

• 环保无铅

  Active

• 美国海关商品代码

  8542.32.00.28

• Automotive

  Yes

• PPAP

  Yes

• DRAM Type

  SDRAM

• Chip Density (bit)

  512M

• Organization

  32Mx16

• Number of Internal Banks

  4

• Number of Words per Bank

  8M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  143

• Maximum Access Time (ns)

  5.4

• Address Bus Width (bit)

  15

• Interface Type

  LVTTL

• Minimum Operating Supply Voltage (V)

  3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  150

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Automotive

• Number of I/O Lines (bit)

  16

• Mounting

  Surface Mount

• Package Height

  0.8(Max) + 0.15

• Package Width

  8

• Package Length

  13

• PCB changed

  54

• Standard Package Name

  BGA

• Supplier Package

  TW-BGA

• Pin Count

  54