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IS45S16100H7TLA1|ISSI|simage
IS45S16100H7TLA1|ISSI|limage
DRAM Chip

IS45S16100H-7TLA1

DRAM Chip SDRAM 16Mbit 1Mx16 3.3V 50-Pin TSOP-II Automotive AEC-Q100

Integrated Silicon Solution Inc
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.32.00.02
  • Automotive
    Yes
  • PPAP
    Yes
  • DRAM Type
    SDRAM
  • Chip Density (bit)
    16M
  • Organization
    1Mx16
  • Number of Internal Banks
    2
  • Number of Words per Bank
    512K
  • Number of Bits/Word (bit)
    16
  • Data Bus Width (bit)
    16
  • Maximum Clock Rate (MHz)
    143
  • Maximum Access Time (ns)
    6|5.5
  • Address Bus Width (bit)
    12
  • Interface Type
    LVTTL
  • Minimum Operating Supply Voltage (V)
    3
  • Maximum Operating Supply Voltage (V)
    3.6
  • Operating Current (mA)
    70
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Automotive
  • Number of I/O Lines (bit)
    16
  • Mounting
    Surface Mount
  • Package Height
    1.05(Max)
  • Package Width
    10.16
  • Package Length
    20.95
  • PCB changed
    50
  • Standard Package Name
    SO
  • Supplier Package
    TSOP-II
  • Pin Count
    50
  • Lead Shape
    Gull-wing

Documentation and Resources

Datasheets
Design resources