DRAM Chip

IS45S16100H-7BLA2

DRAM Chip SDRAM 16Mbit 1Mx16 3.3V 60-Pin TFBGA Automotive AEC-Q100

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.02

• Automotive

  Yes

• PPAP

  Yes

• DRAM Type

  SDRAM

• Chip Density (bit)

  16M

• Organization

  1Mx16

• Number of Internal Banks

  2

• Number of Words per Bank

  512K

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  143

• Maximum Access Time (ns)

  6|5.5

• Address Bus Width (bit)

  12

• Interface Type

  LVTTL

• Minimum Operating Supply Voltage (V)

  3

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  80

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  105

• Supplier Temperature Grade

  Automotive

• Number of I/O Lines (bit)

  16

• Mounting

  Surface Mount

• Package Height

  0.85(Max)

• Package Width

  6.4

• Package Length

  10.1

• PCB changed

  60

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  60

• Lead Shape

  Ball