DRAM Chip

IS43TR16K01S2AL-125KBL-TR

DRAM Chip DRAM 16Gbit 1Gx16 1.35V/1.5V 96-Pin LWBGA T/R

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.36

• DRAM Type

  DRAM

• Chip Density (bit)

  16G

• Organization

  1Gx16

• Number of Internal Banks

  8

• Number of Words per Bank

  128M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  1600

• Maximum Access Time (ns)

  0.225

• Address Bus Width (bit)

  19

• Minimum Operating Supply Voltage (V)

  1.283|1.425

• Maximum Operating Supply Voltage (V)

  1.45|1.575

• Operating Current (mA)

  277

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  95

• Supplier Temperature Grade

  Commercial

• Number of I/O Lines (bit)

  16

• Mounting

  Surface Mount

• Package Height

  1.2(Max)

• Package Width

  10

• Package Length

  14

• PCB changed

  96

• Standard Package Name

  BGA

• Supplier Package

  LWBGA

• Pin Count

  96