DRAM Chip

IS43TR16640C-125JBL

DRAM Chip DDR3 SDRAM 1Gbit 64Mx16 1.5V 96-Pin TW-BGA

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.32

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR3 SDRAM

• Chip Density (bit)

  1G

• Organization

  64Mx16

• Number of Internal Banks

  8

• Number of Words per Bank

  8M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  1600

• Maximum Access Time (ns)

  0.225

• Address Bus Width (bit)

  16

• Process Technology

  25nm

• Minimum Operating Supply Voltage (V)

  1.425

• Maximum Operating Supply Voltage (V)

  1.575

• Operating Current (mA)

  200

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  95

• Supplier Temperature Grade

  Commercial

• Number of I/O Lines (bit)

  16

• Mounting

  Surface Mount

• Package Height

  1(Max)

• Package Width

  9

• Package Length

  13

• PCB changed

  96

• Standard Package Name

  BGA

• Supplier Package

  TW-BGA

• Pin Count

  96