DRAM Chip

IS43TR16512BL-107MBL

DRAM Chip DDR3L SDRAM 8Gbit 512Mx16 1.35V 96-Pin TW-BGA Tray

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.36

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR3L SDRAM

• Chip Density (bit)

  8G

• Organization

  512Mx16

• Number of Internal Banks

  8

• Number of Words per Bank

  64M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  1866

• Maximum Access Time (ns)

  0.195

• Address Bus Width (bit)

  19

• Minimum Operating Supply Voltage (V)

  1.283

• Maximum Operating Supply Voltage (V)

  1.45

• Operating Current (mA)

  223

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  95

• Supplier Temperature Grade

  Commercial

• Number of I/O Lines (bit)

  16

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1(Max)

• Package Width

  10

• Package Length

  14

• PCB changed

  96

• Standard Package Name

  BGA

• Supplier Package

  TW-BGA

• Pin Count

  96

• Lead Shape

  Ball