DRAM Chip

IS43TR16256BL-125KBL

DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V 96-Pin TW-BGA Tray

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.36

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR3L SDRAM

• Chip Density (bit)

  4G

• Organization

  256Mx16

• Number of Internal Banks

  8

• Number of Words per Bank

  32M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  1600

• Maximum Access Time (ns)

  0.225

• Address Bus Width (bit)

  18

• Process Technology

  25nm

• Minimum Operating Supply Voltage (V)

  1.283

• Maximum Operating Supply Voltage (V)

  1.45

• Operating Current (mA)

  215

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  95

• Supplier Temperature Grade

  Commercial

• Number of I/O Lines (bit)

  16

• Packaging

  Tray

• Mounting

  Surface Mount

• Package Height

  1(Max) mm

• Package Width

  9 mm

• Package Length

  13 mm

• PCB changed

  96

• Standard Package Name

  BGA

• Supplier Package

  TW-BGA

• Pin Count

  96

• Lead Shape

  Ball