DRAM Chip

IS43R83200F-6TLI-TR

DRAM Chip DDR SDRAM 256Mbit 32Mx8 2.5V 66-Pin TSOP-II T/R

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  LTB

• HTS

  8542.32.00.24

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR SDRAM

• Chip Density (bit)

  256M

• Organization

  32Mx8

• Number of Internal Banks

  4

• Number of Words per Bank

  8M

• Number of Bits/Word (bit)

  8

• Data Bus Width (bit)

  8

• Maximum Clock Rate (MHz)

  166

• Maximum Access Time (ns)

  0.7

• Address Bus Width (bit)

  15

• Interface Type

  SSTL_2

• Minimum Operating Supply Voltage (V)

  2.3

• Maximum Operating Supply Voltage (V)

  2.7

• Operating Current (mA)

  170

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  8

• Packaging

  Tape and Reel

• Mounting

  Surface Mount

• Package Height

  1

• Package Width

  10.16

• Package Length

  22.22

• PCB changed

  66

• Standard Package Name

  SO

• Supplier Package

  TSOP-II

• Pin Count

  66

• Lead Shape

  Gull-wing