DRAM Chip

IS43R32160D-5BL-TR

DRAM Chip DDR SDRAM 512Mbit 16Mx32 2.6V 144-Pin LFBGA T/R

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.28

• Automotive

  No

• PPAP

  No

• DRAM Type

  DDR SDRAM

• Chip Density (bit)

  512M

• Organization

  16Mx32

• Number of Internal Banks

  4

• Number of Words per Bank

  4M

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  200

• Maximum Access Time (ns)

  0.7

• Address Bus Width (bit)

  15

• Interface Type

  SSTL_2

• Minimum Operating Supply Voltage (V)

  2.5

• Maximum Operating Supply Voltage (V)

  2.7

• Operating Current (mA)

  590

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  70

• Supplier Temperature Grade

  Commercial

• Number of I/O Lines (bit)

  32

• Packaging

  Tape and Reel

• Mounting

  Surface Mount

• Package Height

  1.02(Max)

• Package Width

  12

• Package Length

  12

• PCB changed

  144

• Standard Package Name

  BGA

• Supplier Package

  LFBGA

• Pin Count

  144

• Lead Shape

  Ball