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DRAM Chip

IS43QR16256B-083RBL-TR

DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V 96-Pin TWBGA T/R

Integrated Silicon Solution Inc
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.32.00.36
  • Automotive
    No
  • PPAP
    No
  • DRAM Type
    DDR4 SDRAM
  • Chip Density (bit)
    4G
  • Organization
    256Mx16
  • Number of Internal Banks
    8
  • Number of Words per Bank
    32M
  • Number of Bits/Word (bit)
    16
  • Data Bus Width (bit)
    16
  • Maximum Clock Rate (MHz)
    2400
  • Maximum Access Time (ns)
    0.175
  • Address Bus Width (bit)
    17
  • Interface Type
    POD
  • Minimum Operating Supply Voltage (V)
    1.14
  • Maximum Operating Supply Voltage (V)
    1.26
  • Operating Current (mA)
    365
  • Minimum Operating Temperature (°C)
    0
  • Maximum Operating Temperature (°C)
    95
  • Supplier Temperature Grade
    Commercial
  • Number of I/O Lines (bit)
    16
  • Packaging
    Tape and Reel
  • Mounting
    Surface Mount
  • Package Height
    1(Max)
  • Package Width
    7.5
  • Package Length
    13.5
  • PCB changed
    96
  • Standard Package Name
    BGA
  • Supplier Package
    TWBGA
  • Pin Count
    96

Documentation and Resources

Datasheets
Design resources