DRAM Chip

IS43LR32640A-6BL

DRAM Chip Mobile-DDR SDRAM 2Gbit 64Mx32 1.8V 90-Pin WBGA

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Obsolete

• HTS

  COMPONENTS

• Automotive

  No

• PPAP

  No

• DRAM Type

  Mobile-DDR SDRAM

• Chip Density (bit)

  2G

• Organization

  64Mx32

• Number of Internal Banks

  4

• Number of Words per Bank

  16M

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  200

• Maximum Access Time (ns)

  8|5

• Address Bus Width (bit)

  16

• Interface Type

  LVCMOS

• Minimum Operating Supply Voltage (V)

  1.7

• Maximum Operating Supply Voltage (V)

  1.95

• Operating Current (mA)

  180

• Minimum Operating Temperature (°C)

  0

• Maximum Operating Temperature (°C)

  70

• Supplier Temperature Grade

  Commercial

• Number of I/O Lines (bit)

  32

• Mounting

  Surface Mount

• Package Height

  1(Max)

• Package Width

  8

• Package Length

  13

• PCB changed

  90

• Standard Package Name

  BGA

• Supplier Package

  WBGA

• Pin Count

  90

• Lead Shape

  Ball