DRAM Chip
IS43LD32320C-18BLI
DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 32Mx32 1.2V/1.8V 134-Pin TFBGA
Integrated Silicon Solution IncProduct Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
8542.32.00.32
Automotive
No
PPAP
No
DRAM Type
Mobile LPDDR2 SDRAM
Chip Density (bit)
1G
Organization
32Mx32
Number of Internal Banks
8
Number of Words per Bank
4M
Number of Bits/Word (bit)
32
Data Bus Width (bit)
32
Maximum Clock Rate (MHz)
1066
Maximum Access Time (ns)
10
Address Bus Width (bit)
12
Interface Type
HSUL_12
Minimum Operating Supply Voltage (V)
1.14|1.7
Maximum Operating Supply Voltage (V)
1.3|1.95
Operating Current (mA)
230
Minimum Operating Temperature (°C)
-40
Maximum Operating Temperature (°C)
85
Supplier Temperature Grade
Industrial
Number of I/O Lines (bit)
32
Mounting
Surface Mount
Package Height
0.7(Max) mm
Package Width
10 mm
Package Length
11.5 mm
PCB changed
134
Standard Package Name
BGA
Supplier Package
TFBGA
Pin Count
134
Lead Shape
Ball