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DRAM Chip

IS43LD32320C-18BLI

DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 32Mx32 1.2V/1.8V 134-Pin TFBGA

Integrated Silicon Solution Inc
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.32.00.32
  • Automotive
    No
  • PPAP
    No
  • DRAM Type
    Mobile LPDDR2 SDRAM
  • Chip Density (bit)
    1G
  • Organization
    32Mx32
  • Number of Internal Banks
    8
  • Number of Words per Bank
    4M
  • Number of Bits/Word (bit)
    32
  • Data Bus Width (bit)
    32
  • Maximum Clock Rate (MHz)
    1066
  • Maximum Access Time (ns)
    10
  • Address Bus Width (bit)
    12
  • Interface Type
    HSUL_12
  • Minimum Operating Supply Voltage (V)
    1.14|1.7
  • Maximum Operating Supply Voltage (V)
    1.3|1.95
  • Operating Current (mA)
    230
  • Minimum Operating Temperature (°C)
    -40
  • Maximum Operating Temperature (°C)
    85
  • Supplier Temperature Grade
    Industrial
  • Number of I/O Lines (bit)
    32
  • Mounting
    Surface Mount
  • Package Height
    0.7(Max) mm
  • Package Width
    10 mm
  • Package Length
    11.5 mm
  • PCB changed
    134
  • Standard Package Name
    BGA
  • Supplier Package
    TFBGA
  • Pin Count
    134
  • Lead Shape
    Ball

Documentation and Resources

Datasheets
Design resources