DRAM Chip

IS43LD32128B-25BPLI-TR

DRAM Chip Mobile LPDDR2 SDRAM 4Gbit 128Mx32 1.8V/1.2V 168-Pin TFBGA

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• DRAM Type

  Mobile LPDDR2 SDRAM

• Chip Density (bit)

  4G

• Organization

  128Mx32

• Number of Internal Banks

  8

• Number of Words per Bank

  16M

• Number of Bits/Word (bit)

  32

• Data Bus Width (bit)

  32

• Maximum Clock Rate (MHz)

  800

• Maximum Access Time (ns)

  10

• Address Bus Width (bit)

  17

• Interface Type

  HSUL_12

• Minimum Operating Supply Voltage (V)

  1.7|1.14

• Maximum Operating Supply Voltage (V)

  1.95|1.3

• Operating Current (mA)

  380

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  32

• Mounting

  Surface Mount

• Package Height

  0.76(Max)

• Package Width

  12

• Package Length

  12

• PCB changed

  168

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  168