DRAM Chip

IS43LD16640C-25BLI-TR

DRAM Chip Mobile LPDDR2 SDRAM 1Gbit 64Mx16 1.2V/1.8V 134-Pin TFBGA T/R

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.32

• Automotive

  No

• PPAP

  No

• DRAM Type

  Mobile LPDDR2 SDRAM

• Chip Density (bit)

  1G

• Organization

  64Mx16

• Number of Internal Banks

  8

• Number of Words per Bank

  8M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  800

• Address Bus Width (bit)

  16

• Interface Type

  HSUL_12

• Minimum Operating Supply Voltage (V)

  1.14|1.7

• Maximum Operating Supply Voltage (V)

  1.3|1.95

• Operating Current (mA)

  200

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  16

• Packaging

  Tape and Reel

• Mounting

  Surface Mount

• Package Height

  0.7(Max)

• Package Width

  10

• Package Length

  11.5

• PCB changed

  134

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  134