DRAM Chip

IS43LD16320A-25BLI

DRAM Chip Mobile LPDDR2 SDRAM 512Mbit 32Mx16 1.2V/1.8V 134-Pin TFBGA

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.28

• Automotive

  No

• PPAP

  No

• DRAM Type

  Mobile LPDDR2 SDRAM

• Chip Density (bit)

  512M

• Organization

  32Mx16

• Number of Internal Banks

  4

• Number of Words per Bank

  8M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  400

• Address Bus Width (bit)

  15

• Interface Type

  HSUL_12

• Minimum Operating Supply Voltage (V)

  1.14|1.7

• Maximum Operating Supply Voltage (V)

  1.3|1.95

• Operating Current (mA)

  160

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  16

• Mounting

  Surface Mount

• Package Height

  0.7(Max) mm

• Package Width

  10 mm

• Package Length

  11.5 mm

• PCB changed

  134

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  134

• Lead Shape

  Ball