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DRAM Chip

IS43LD16256C-18BLI

4Gb (x16, x32) Mobile LPDDR2 S4 SDRAM

Integrated Silicon Solution Inc
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.32.00.36
  • Automotive
    No
  • PPAP
    No
  • Chip Density (bit)
    4G
  • Organization
    256Mx16
  • Number of Bits/Word (bit)
    16
  • Maximum Clock Rate (MHz)
    533
  • Mounting
    Surface Mount
  • Package Height
    0.6(Max)
  • Package Width
    10
  • Package Length
    11.5
  • PCB changed
    134
  • Standard Package Name
    BGA
  • Supplier Package
    VFBGA
  • Pin Count
    134

Documentation and Resources

Datasheets
Design resources