DRAM Chip

IS42SM16320E-75BLI-TR

DRAM Chip Mobile SDRAM 512Mbit 32Mx16 3.3V 54-Pin TFBGA T/R

Integrated Silicon Solution Inc

Product Technical Specifications

• EU RoHS

  Compliant

• ECCN (US)

  EAR99

• Part Status

  Active

• HTS

  8542.32.00.28

• Automotive

  No

• PPAP

  No

• DRAM Type

  Mobile SDRAM

• Chip Density (bit)

  512M

• Organization

  32Mx16

• Number of Internal Banks

  4

• Number of Words per Bank

  8M

• Number of Bits/Word (bit)

  16

• Data Bus Width (bit)

  16

• Maximum Clock Rate (MHz)

  133

• Maximum Access Time (ns)

  8|6

• Address Bus Width (bit)

  15

• Interface Type

  LVCMOS

• Minimum Operating Supply Voltage (V)

  2.7

• Maximum Operating Supply Voltage (V)

  3.6

• Operating Current (mA)

  110

• Minimum Operating Temperature (°C)

  -40

• Maximum Operating Temperature (°C)

  85

• Supplier Temperature Grade

  Industrial

• Number of I/O Lines (bit)

  16

• Packaging

  Tape and Reel

• Mounting

  Surface Mount

• Package Height

  0.8(Max)

• Package Width

  8

• Package Length

  8

• PCB changed

  54

• Standard Package Name

  BGA

• Supplier Package

  TFBGA

• Pin Count

  54