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DRAM Chip

IS42S32800J-75ETL-TR

DRAM Chip SDRAM 256Mbit 8Mx32 3.3V 86-Pin TSOP-II T/R

Integrated Silicon Solution Inc
Datasheets 

Product Technical Specifications
  • EU RoHS
    Compliant
  • ECCN (US)
    EAR99
  • Part Status
    Active
  • HTS
    8542.32.00.24
  • Automotive
    No
  • PPAP
    No
  • DRAM Type
    SDRAM
  • Chip Density (bit)
    256M
  • Organization
    8Mx32
  • Number of Internal Banks
    4
  • Number of Words per Bank
    2M
  • Number of Bits/Word (bit)
    32
  • Data Bus Width (bit)
    32
  • Address Bus Width (bit)
    14
  • Interface Type
    LVTTL
  • Minimum Operating Supply Voltage (V)
    3
  • Maximum Operating Temperature (°C)
    70
  • Number of I/O Lines (bit)
    32
  • Mounting
    Surface Mount
  • Package Height
    1
  • Package Width
    10.16
  • Package Length
    22.22
  • PCB changed
    86
  • Supplier Package
    TSOP-II
  • Pin Count
    86

Documentation and Resources

Datasheets
Design resources